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Saw mark inspection using displacement measurement sensors

Measuring the depth of saw marks directly after the wire saw procedure makes it possible to scrap wafers as soon as possible. The OD5000 displacement measurement sensor enables quick process lead times for high-precision saw mark inspection.

  • Following product families can be used
    Product family OD5000
    The expert for high performance measurement
    • Measuring frequency up to 80 kHz
    • Ethernet interface with TCP/IP protocol directly in the sensor head
    • Web server interface for configuration
    • Innovative analysis algorithm
    • Maximum repeatability for positioning tasks
    • Detection and measurement of the smallest indentations or holes
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