Saw mark inspection on solar wafers

The wire saw process can gouge the wafer surface, and as the depth increases, so does the risk of breakage. The OD Precision laser short range distance sensor can measure depth with greater than 1 μm repeatability. Three read heads can be connected to one evaluation unit, a cost-effective and elegant method to reduce waste.

  • Following product families can be used
    Measuring each dimension with high precision
    • Numerous measuring ranges from 24 mm ... 26 mm to 300 mm ... 700 mm
    • CMOS receiving element for measurement independent of surface
    • Maximum measurement accuracy and frequency
    • Glass thickness measurement with just one sensor head
    • Various light spot sizes
    • Integrated calculations for up to three sensors
    • Stand-alone use via RS-422