Measuring layer thicknesses on semiconductor wafers

Manufacturing electronic switches in microstructures on semiconductors is a highly complex process. To ensure that these switches meet the set requirements, i.e., have reliable web and layer structures, and to reduce material wastage at the same time, measurements of the layer thicknesses are essential. Since the thicknesses of the layers assigned must fall within the µm range, a suitable measuring system must be used. The OC Sharp is particularly suitable for these kinds of tasks. With this distance sensor, the layer thicknesses of semiconductors can be determined with the highest possible level of accuracy from 3 µm, and in a resolution within the nm range.

  • Following product families can be used
    Chromatic confocal measuring technology offers maximum precision
    • Many measuring lengths from 600 µm up to 12 mm
    • Chromatic confocal sensor technology for the highest reliability and precision
    • High measuring frequency of up to 4,000 Hz
    • Reliably measures a wide range of materials and colors
    • Measures the thickness of transparent materials using just one sensor head (chromatic confocal for thicknesses from 30 µm and interferometric for thicknesses from 3 µm)
    • Very small light spot is able to measure minuscule objects
    • Easy-to-use programming with OC Sharp software