Measuring layer thicknesses on semiconductor wafers

Manufacturing electronic switches in microstructures on semiconductors is a highly complex process. To ensure that these switches meet the set requirements, i.e., have reliable web and layer structures, and to reduce material wastage at the same time, measurements of the layer thicknesses are essential. Since the thicknesses of the layers assigned must fall within the µm range, a suitable measuring system must be used. The OC Sharp is particularly suitable for these kinds of tasks. With this distance sensor, the layer thicknesses of semiconductors can be determined with the highest possible level of accuracy from 3 µm, and in a resolution within the nm range.