3D inspection and surveying of semiconductor chip connections

Before dispatching finished semiconductor chips, it is necessary to perform a demanding burn-in test at final inspection. This involves testing both the functionality and mechanical integrity of the semiconductor chips as well as the quality of the contact points and their coplanarity in ball grid arrays (BGAs). The Ranger3 3D vision system performs this inspection by generating up to 46,000 3D profiles per second and with the necessary precision demanded by the industry.