Experiencing Industry 4.0 at first hand - SICK at the Hannover Messe 2017
Waldkirch, February 2017 – At the Hannover Messe 2017, SICK will present the next step toward Industry 4.0. Using an example of a value added process, the company will demonstrate the sensor features that lead to more flexibility for machine operators. As a result, visitors to the exhibition will be able to experience the enhancements at first hand.
The exhibit will highlight the challenges relating to Industry 4.0 and the appropriate solutions from SICK's perspective. These challenges occur at basic levels of the value added process and find solutions in the form of SICK sensor technology, systems, and services. The products that will be on display are actively enabled for communication, ensuring that they can establish links with the world of data. With the aid of a cloud provider, the data that is collected is compiled and then evaluated and visualized accordingly.
Flexibility, profitability and transparency
The Internet of Things makes information available to everyone at any time. In addition, customers increasingly expect fast, flexible services. As a result, production and logistics processes must also be as flexible as possible, while at the same time allowing for increases in productivity. This can be achieved by using intelligent and flexible sensors that enable batch size 1 to be manufactured quickly and cost-effectively. Intelligent sensors offer significant added value in this respect. They allow improvements to be made while the system is in operation, without production having to be interrupted.
The challenges involved in Industry 4.0 cannot be overcome without the large volumes of data captured and pre-evaluated by intelligent SICK sensors before they are sent out into the world of data. SICK sensors guarantee transparency at every stage of the value added process. In addition, they are backwardly compatible. Industry 4.0 sensors can be used in existing automation architectures, but they can also communicate with higher-level systems.
Hall 9, Stand F18