Double layer detection of solar wafers in cell production

Thin wafers can accidentally stick together, and will break in later processes. SICK’s UM18-20012 ultrasonic sensor has double sheet detection built in, and works on printed wafers. Another example of SICK’s commitment to sense where the process requires it.

  • Following product families can be used
    • Material classifications: no layers, single layer, double layers
    • Plug-and-play; sensitivity levels that can be selected, taught in, and changed during operation
    • Up to four individual sensitivity levels
    • Variable mounting distance
    • LEDs visible from any direction
    • Immune to dirt, dust, and humidity