Inspection of the silicon block

In the challenge to maximize wafer yields, 3D data is essential in the decision process. The IVC-3D camera integrates advanced image processing software on-board. Now, surface defect evaluation on low contrast ingots can be successfully automated, and accurate dimensioning can be gathered by the same device.

  • Following product families can be used
    Advanced 3D image processing made easy
    • Easy 3D measurement – provides information about object height, shape and volume
    • Independent of object contrast and color
    • Easy-to-use graphical user interface for fast application development
    • Simple connection of PLCs, robots, and other control systems, e.g., those using Ethernet/IP or OPC
    • Scans up to 5,000 profiles per second
    • Industrial, rugged metal housing