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Our Technology 

 
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Machine Vision Technology 

   

The art of industrial machine vision is to learn a computer to analyze what a camera sees and from millions of pixels extract information that is critical in an industrial process.
The technical challenge is to develop smart algorithms and efficient hardware that reduces the large amount of data in an image and come to a simple answer like “OK” or a simple measurement value. Optical technologies like, laser, illumination, lens system etc are also very important parts in Machine Vision. 

  • 2D Machine Vision Technology
  • 3D with Laser Line Triangulation
  • MultiScan
  • The Intelligent Imager
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2D Machine Vision Technology: 

 

 
 
Our 2D products are based on CCD sensors and processors with FPGA acceleration built in small industrial packages that communicates the result to a PLC via Ethernet or serial communication. A core algorithm in our 2D cameras is a world leading  method to find known objects in a picture independent of position, rotation and size.
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3D with Laser Line Triangulation: 

 

 
 
Our products for high speed 3D Machine Vision are based on laser line triangulation, which is a well proven and robust method for acquiring high quality 3D shapes. The camera analyzes the contour of a laser line projected from a different angle relative to the camera.The height is calculated from the position of the laser line analyzed by the camera.
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MultiScan:  

 

 
 
MultiScan is an exiting new field in Machine Vision. This is the art of having a single camera acquire several feature images simultaneously. A feature image can be grayscale, color, 3D, and be glossy, transparent etc. MultiScan allows for unprecedented applications in Machine Vision. We developed the sensors with processors in the chip that make this unparalleled technology possible.
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The Intelligent Imager: 

 

 
 
The power of our 3D products comes from the Intelligent Imager. It is a combination of image sensor, A/D-converters and general-purpose image
processors on the same semiconductor chip. The built-in processor array handles a full row of pixels in parallel. It is based on an SIMD (Single Instruction, Multiple Data ) architecture containing
1536 parallel processing elements.
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SICK IVP AB
Wallenbergs gata 4
SE-583 35 Linköping
Sweden
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