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Solutions for the automation in the Electronics Industry
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Wafer processing
Semiconductor front-end
Clean-room conditions, aggressive media, high temperatures, poorly accessible sensor locations – wafer processing and quality assurance make extreme demands on detection and safety technology. These sensor systems from SICK are ready for them: compact, robust, easily installed, reliable and powerful.
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Chip assembly
Semiconductor back-end
Those who produce chips cannot afford to make any compromises. Too much depends upon the quality of the components. Production process requirements are correspondingly high. From detecting the presence of “naked” lead frames in a stack, to inspecting the quality of finished encapsulated and separated chips – SICK sensors permit assured production with high cycle speeds.
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PCB assembly
The production of electronic circuit boards is subject to particular price pressure, whereby the quality must be right. High-end results in maximum possible cycle speeds – SICK sensors and camera systems permit increases in performance at all points of PCB assembly, from the first loader contact to feeding of the assembled circuit boards to the soldering oven.
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Final assembly
Electronic products
Controlling conveyor belts, checking occupancy, identifying workpieces – the final assembly of electronic products demands versatile, flexible and economical sensor solutions. SICK offers precisely the product portfolio required: distance sensors, vision cameras, photoelectric sensors, proximity sensors, bar code readers and safety systems – technically sophisticated and proven in the most varied of applications.
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